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公开(公告)号：US10818432B2
公开(公告)日：2020-10-27
申请号：US16121701
申请日：2018-09-05
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.
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公开(公告)号：US10804035B2
公开(公告)日：2020-10-13
申请号：US15819804
申请日：2017-11-21
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Katsumi Kobayashi , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.
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公开(公告)号：US10566139B2
公开(公告)日：2020-02-18
申请号：US16162580
申请日：2018-10-17
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: A ceramic electronic device includes a chip component, a metal terminal, and a conductive connection member. The component includes a terminal electrode surface on which a terminal electrode is formed. The metal terminal includes an opposing surface to the electrode surface. The connection member contains at least Sn and Sb and connects the terminal electrode surface and the opposing surface. The connection member includes a first part and a second part. In the first part, a distance between the terminal electrode surface and the opposing surface is a first distance, and Sb/Sn is a first value. In the second part, a distance between the terminal electrode surface and the opposing surface is a second distance being smaller than the first distance, and Sb/Sn is a second value being larger than the first value.
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公开(公告)号：US10381157B2
公开(公告)日：2019-08-13
申请号：US15928752
申请日：2018-03-22
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Katsumi Kobayashi , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.
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公开(公告)号：US11302473B2
公开(公告)日：2022-04-12
申请号：US16452042
申请日：2019-06-25
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.
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Patent Agency Ranking
公开(公告)号：US10916375B2
公开(公告)日：2021-02-09
申请号：US16367937
申请日：2019-03-28
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body and sandwiches the chip component. A width, a protrusion length, or a protrusion area of one of the pair of holding pieces is different from that of the other holding piece.
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公开(公告)号：US10796854B2
公开(公告)日：2020-10-06
申请号：US16353747
申请日：2019-03-14
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The holding pieces are formed on the terminal body. A connection member configured to connect the terminal body and the end surface of the terminal body exists in a joint region between the terminal body and the end surface of the terminal electrode. A pair of reinforcement pieces is formed on the terminal body so as not to overlap with the joint region in a direction extending from one to the other of the pair of holding pieces.
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公开(公告)号：US10559426B2
公开(公告)日：2020-02-11
申请号：US15938561
申请日：2018-03-28
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: An electronic device includes a chip component and an external terminal. The chip component includes a terminal electrode formed on an end surface of a ceramic element body containing an internal electrode. The external terminal includes a first end electrically connected with the terminal electrode and a second end disposed opposite to the first end and connected with a mounting surface. The external terminal includes a first metal and a second metal different from the first metal. The first metal and the second metal are alternately exposed on a surface of the external terminal.
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公开(公告)号：US11443897B2
公开(公告)日：2022-09-13
申请号：US17243961
申请日：2021-04-29
Applicant: TDK CORPORATION
Inventor： Toshihiro Iguchi , Norihisa Ando , Kenya Tamaki , Kayou Matsunaga
Abstract: An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.
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公开(公告)号：US10984953B2
公开(公告)日：2021-04-20
申请号：US16369813
申请日：2019-03-29
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.
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