An installation structure of a temperature fuse is disclosed. The temperature fuse includes a first leg fixed to one surface of a printed circuit board (PCB), a bent part formed to be bent several times in an outer direction of the PCB from an end part of the first leg, and a second leg incorporated with the bent part and fixed to one surface of the PCB while being spaced apart from the first leg by a predetermined distance. The installation structure of the temperature fuse includes a third leg formed to extend from any one of the first leg and the second leg, a conductive member electrically connected to the third leg while being electrically isolated from the PCB, and a sensing part electrically connected to the third leg through the conductive member, and configured to detect whether a connection state between the third leg and the conductive member is normal.