Invention Grant
- Patent Title: Package of photoelectric device
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Application No.: US16423131Application Date: 2019-05-27
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Publication No.: US10985297B2Publication Date: 2021-04-20
- Inventor: Yen-Ching Kuo , Chien-Chang Hung , Jane-Hway Liao , Yi-Hsiang Huang , Shu-Tang Yeh , Hong-Ming Dai , Hung-Yi Chen
- Applicant: Industrial Technology Research Institute , Intellectual Property Innovation Corporation
- Applicant Address: TW Hsinchu; TW Hsinchu
- Assignee: Industrial Technology Research Institute,Intellectual Property Innovation Corporation
- Current Assignee: Industrial Technology Research Institute,Intellectual Property Innovation Corporation
- Current Assignee Address: TW Hsinchu; TW Hsinchu
- Agency: JCIPRNET
- Priority: TW108106381 20190225
- Main IPC: H01L33/56
- IPC: H01L33/56 ; H01L33/50 ; H01L33/60

Abstract:
A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to 10 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.
Information query
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