Invention Grant
- Patent Title: Assembled wire, method of producing the same, and electrical equipment using the same
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Application No.: US15982751Application Date: 2018-05-17
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Publication No.: US10991483B2Publication Date: 2021-04-27
- Inventor: Keisuke Ikeda , Hideo Fukuda
- Applicant: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.
- Current Assignee: ESSEX FURUKAWA MAGNET WIRE JAPAN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2015-227868 20151120
- Main IPC: H01B7/02
- IPC: H01B7/02 ; H01B7/30 ; H01B13/00 ; H01B7/00 ; H01B13/14 ; H01B3/42 ; H01R4/02 ; H01R4/70
Abstract:
An assembled wire, having: an assembled conductor composed of a plurality of conductor strands each having a rectangular cross-section, stacked and arranged each other across an interlayer insulating layer; an insulating outer layer that coats the assembled conductor including the interlayer insulating layer; and an adhesion layer composed of a thermoplastic resin having a thickness of 3 μm or more and 10 μm or less between the assembled conductor and the insulating outer layer.
Public/Granted literature
- US20180268962A1 ASSEMBLED WIRE, METHOD OF PRODUCING THE SAME, AND ELECTRICAL EQUIPMENT USING THE SAME Public/Granted day:2018-09-20
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