Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US16137625Application Date: 2018-09-21
-
Publication No.: US10991694B2Publication Date: 2021-04-27
- Inventor: Sung-Dae Suk , Jongho Lee , Geumjong Bae
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2016-0023242 20160226
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238 ; H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L29/786 ; H01L23/535 ; H01L29/417

Abstract:
A semiconductor device includes an insulating layer on a substrate, a channel region on the insulating layer, a gate structure on the insulating layer, the gate structure crossing the channel region, source/drain regions on the insulating layer, the source/drain regions being spaced apart from each other with the gate structure interposed therebetween, the channel region connecting the source/drain regions to each other, and contact plugs connected to the source/drain regions, respectively. The channel region includes a plurality of semiconductor patterns that are vertically spaced apart from each other on the insulating layer, the insulating layer includes first recess regions that are adjacent to the source/drain regions, respectively, and the contact plugs include lower portions provided into the first recess regions, respectively.
Public/Granted literature
- US20190027475A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-01-24
Information query
IPC分类: