Invention Grant
- Patent Title: Semiconductor integrated circuitry
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Application No.: US16244010Application Date: 2019-01-09
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Publication No.: US10992261B2Publication Date: 2021-04-27
- Inventor: Bernd Hans Germann , Vamshi Krishna Manthena
- Applicant: SOCIONEXT INC.
- Applicant Address: JP Yokohama
- Assignee: SOCIONEXT INC.
- Current Assignee: SOCIONEXT INC.
- Current Assignee Address: JP Yokohama
- Agency: Arent Fox LLP
- Priority: EP18152590 20180119
- Main IPC: H03B5/12
- IPC: H03B5/12 ; H03C3/09 ; H03L7/099 ; H01L23/522 ; H01L23/528 ; H01L23/538 ; H01L49/02 ; H03L7/16

Abstract:
In semiconductor integrated circuitry having metal layers and via layers sandwiched between adjacent said metal layers, a capacitor is formed from metal structures implemented in first to third metal layers. The metal structures comprise strips having widths parallel to the layers. The strips of the first layer form a first comb having a base strip and a plurality of finger strips extending from the base strip, the widths of the strips being in a lower range of widths. The strips of the second layer form a second comb having a base strip and a plurality of finger strips extending from the base strip, the widths of the finger strips being in the lower range of widths. The width of each base strip formed in the second layer is in an intermediate range of widths; and the strips formed in the third layer have widths in a higher range of widths.
Public/Granted literature
- US20190229676A1 SEMICONDUCTOR INTEGRATED CIRCUITRY Public/Granted day:2019-07-25
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