- 专利标题： Epoxy compound, curable composition, cured product, method of producing epoxy compound, and reactive diluent
-
申请号： US16084375申请日： 2017-03-13
-
公开(公告)号： US10995079B2公开(公告)日： 2021-05-04
- 发明人: Atsushi Kameyama , Ryuichi Ueno , Hisashi Sone , Hiroaki Suzuki , Shohei Takata , Takashi Seki
- 申请人： ENEOS CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： ENEOS CORPORATION
- 当前专利权人： ENEOS CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JPJP2016-049712 20160314,JPJP2016-107724 20160530,JPJP2016-120014 20160616,JPJP2016-188868 20160927,JPJP2016-188882 20160927
- 国际申请： PCT/JP2017/010040 WO 20170313
- 国际公布： WO2017/159637 WO 20170921
- 主分类号： C07D303/06
- IPC分类号： C07D303/06 ; C07D301/14 ; C08G59/20 ; C08L63/00 ; C07D303/04 ; C08G65/14 ; C08G65/10 ; C07D301/12
摘要：
The present invention discloses a monoepoxy compound represented by the following Formula (1), a curable composition containing the same, a cured product therefrom, a method of producing the monoepoxy compound, and a reactive diluent containing the monoepoxy compound. The monoepoxy compound represented by the Formula (1) is useful in that it is capable of reducing the viscosity of a curable composition containing the monoepoxy compound, while preventing a reduction in the heat resistance of the curable composition as well as a reduction in the weight of the curable composition upon curing. (In the Formula (1), R1 to R6 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group.)
公开/授权文献
信息查询
