公开(公告)号：US10995079B2

公开(公告)日：2021-05-04

申请号：US16084375

申请日：2017-03-13

Applicant: ENEOS CORPORATION

Inventor： Atsushi Kameyama ,  Ryuichi Ueno ,  Hisashi Sone ,  Hiroaki Suzuki ,  Shohei Takata ,  Takashi Seki

IPC: C07D303/06 ,  C07D301/14 ,  C08G59/20 ,  C08L63/00 ,  C07D303/04 ,  C08G65/14 ,  C08G65/10 ,  C07D301/12

Abstract: The present invention discloses a monoepoxy compound represented by the following Formula (1), a curable composition containing the same, a cured product therefrom, a method of producing the monoepoxy compound, and a reactive diluent containing the monoepoxy compound. The monoepoxy compound represented by the Formula (1) is useful in that it is capable of reducing the viscosity of a curable composition containing the monoepoxy compound, while preventing a reduction in the heat resistance of the curable composition as well as a reduction in the weight of the curable composition upon curing. (In the Formula (1), R1 to R6 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group.)

公开(公告)号：US10961345B2

公开(公告)日：2021-03-30

申请号：US16086101

申请日：2017-03-22

Applicant: ENEOS CORPORATION

Inventor： Atsushi Kameyama ,  Ryuichi Ueno ,  Hisashi Sone ,  Shohei Takata ,  Takashi Seki

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C08G65/26

Abstract: The present invention discloses a curable composition comprising: an epoxy compound represented by the following Formula (1); and one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator as well as the cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), A represents CR17R18; B represents CR19R20; R1 to R20 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and n represents 0 or 1, with the proviso that when n is 0, m represents 1, and when n is 1, m represents 0.)

公开(公告)号：US11485717B2

公开(公告)日：2022-11-01

申请号：US17274123

申请日：2019-08-19

Applicant: ENEOS CORPORATION

Inventor： Shohei Takata ,  Kenta Ue ,  Takeshi Koike ,  Atsushi Kameyama

IPC: C07D301/12 ,  B01J23/30 ,  B01J27/055 ,  B01J31/02 ,  C07D407/04 ,  C07D493/04

Abstract: The invention provides a method for producing an epoxy compound by hydrogen peroxide using an organic compound having a carbon-carbon double bond as a raw material, wherein a by-product is suppressed from being generated and the epoxy compound is produced in a high yield. In particular, the invention provides a method for producing an epoxy compound involving oxidizing a carbon-carbon double bond in an organic compound with hydrogen peroxide in the presence of a catalyst, wherein the catalyst comprises a tungsten compound; a phosphoric acid, a phosphonic acid or salts thereof; and an onium salt having an alkyl sulfate ion represented by formula (I) as an anion: wherein R1 is a linear or branched aliphatic hydrocarbon group having 1 to 18 carbons, which may be substituted with 1 to 3 phenyl groups.