Invention Grant
- Patent Title: Time interleaved scan system
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Application No.: US16255214Application Date: 2019-01-23
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Publication No.: US10996267B2Publication Date: 2021-05-04
- Inventor: Jais Abraham , Punit Kishore
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson+Sheridan, L.L.P.
- Main IPC: G01R31/317
- IPC: G01R31/317 ; G01R31/3185

Abstract:
Certain aspects of the present disclosure provide a circuit for testing processor cores. For example, certain aspects provide a circuit having a deserializer having at least one input coupled to at least one input node of the circuit and having a first plurality of outputs, a plurality of processor cores having inputs coupled to the first plurality of outputs of the deserializer, and a serializer having inputs coupled to a second plurality of outputs of the plurality of processor cores.
Public/Granted literature
- US20200233031A1 TIME INTERLEAVED SCAN SYSTEM Public/Granted day:2020-07-23
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