Invention Grant
- Patent Title: Memory circuitry
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Application No.: US16035147Application Date: 2018-07-13
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Publication No.: US10998027B2Publication Date: 2021-05-04
- Inventor: Scott J. Derner , Charles L. Ingalls , Tae H. Kim
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: G11C11/22
- IPC: G11C11/22 ; H01L27/1159 ; H01L27/11592 ; G11C5/02

Abstract:
Some memory circuitry comprises a stack of multiple tiers individually comprising memory cells individually comprising an elevationally-extending transistor. The tiers individually comprise multiple access lines that individually electrically couple together a row of the memory cells in that individual tier. The tiers individually comprise access-line-driver circuitry comprising an elevationally-extending transistor.
Public/Granted literature
- US20190019544A1 Memory Circuitry Public/Granted day:2019-01-17
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