- 专利标题： MEMS microphone and method of manufacturing the MEMS microphone
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申请号： US16745429申请日： 2020-01-17
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公开(公告)号： US10999684B1公开(公告)日： 2021-05-04
- 发明人: Lik Hang Ken Wan , Masashi Shiraishi , Akio Nakao
- 申请人： SAE Magnetics (H.K.) Ltd.
- 申请人地址： HK Hong Kong
- 专利权人： SAE Magnetics (H.K.) Ltd.
- 当前专利权人： SAE Magnetics (H.K.) Ltd.
- 当前专利权人地址： HK Hong Kong
- 主分类号： H04R19/00
- IPC分类号： H04R19/00 ; H04R19/04 ; B81B7/00 ; B81C1/00 ; H04R17/02 ; H04R1/04 ; H04R31/00 ; H04R7/04
摘要：
A MEMS microphone includes a MEMS transducer, a sealing cover, and a package substrate. The MEMS transducer includes an element substrate, a plurality of cantilevered beams, and a weight. An airtight sealing structure is formed with the sealing cover and the package substrate, which is formed by mounting the MEMS transducer on the package substrate, and adhering the sealing cover to the package substrate so as to surround the MEMS transducer.
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