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公开(公告)号：US10999684B1
公开(公告)日：2021-05-04
申请号：US16745429
申请日：2020-01-17
发明人： Lik Hang Ken Wan , Masashi Shiraishi , Akio Nakao
摘要： A MEMS microphone includes a MEMS transducer, a sealing cover, and a package substrate. The MEMS transducer includes an element substrate, a plurality of cantilevered beams, and a weight. An airtight sealing structure is formed with the sealing cover and the package substrate, which is formed by mounting the MEMS transducer on the package substrate, and adhering the sealing cover to the package substrate so as to surround the MEMS transducer.
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公开(公告)号：US10863282B2
公开(公告)日：2020-12-08
申请号：US16262908
申请日：2019-01-30
发明人： Koichi Shiozawa , Masashi Shiraishi , Jumpei Tsuchiya , Lik Hang Ken Wan , Toyotaka Kobayashi , Hironobu Hayashi
摘要： A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip-cover which wraps the MEMS chip, and a cover-supporting part which supports the chip-cover from the inside. In the MEMS package, the chip-cover is supported by the cover-supporting part to form a back chamber, surrounded by the chip-cover and the package substrate.
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公开(公告)号：US20200245076A1
公开(公告)日：2020-07-30
申请号：US16262908
申请日：2019-01-30
发明人： Koichi Shiozawa , Masashi Shiraishi , Jumpei Tsuchiya , Lik Hang Ken Wan , Toyotaka Kobayashi , Hironobu Hayashi
摘要： A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip-cover which wraps the MEMS chip, and a cover-supporting part which supports the chip-cover from the inside. In the MEMS package, the chip-cover is supported by the cover-supporting part to form a back chamber, surrounded by the chip-cover and the package substrate.
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