Invention Grant
- Patent Title: Integrated power delivery board for delivering power to an ASIC with bypass of signal vias in a printed circuit board
-
Application No.: US16222913Application Date: 2018-12-17
-
Publication No.: US10999930B2Publication Date: 2021-05-04
- Inventor: Shobhana Punjabi , Kan Seto , Straty Argyrakis , Joel Richard Goergen , Paul Lachlan Mantiply , Richard Anthony O'Brien
- Applicant: CISCO TECHNOLOGY, INC.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Agent Cindy Kaplan
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/18 ; H05K1/02 ; H05K1/11
Abstract:
In one embodiment, an apparatus generally comprises a power delivery board for integration with a printed circuit board, the power delivery board comprising a power plane for delivering power from a voltage regulator module to an application specific integrated circuit (ASIC) mounted on a first side of the printed circuit board. The power plane in the power delivery board interconnects with power vias in the power delivery board for vertical alignment with the ASIC through power vias in the printed circuit board to electrically couple the voltage regulator module and the ASIC when the power delivery board is mounted on a second side of the printed circuit board.
Information query
