Invention Grant
- Patent Title: Substrate assembly and related methods
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Application No.: US16094411Application Date: 2016-07-22
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Publication No.: US11008214B2Publication Date: 2021-05-18
- Inventor: Sadiq Bengali , Manish Giri
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: Fabian VanCott
- International Application: PCT/US2016/043704 WO 20160722
- International Announcement: WO2018/017134 WO 20180125
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B01L3/00 ; B81B1/00

Abstract:
Example sensor apparatus for microfluidic devices and related methods are disclosed. In examples disclosed herein, a method of fabricating a sensor apparatus for a microfluidic device includes etching a portion of an intermediate layer to form a sensor chamber in a substrate assembly, where the substrate assembly has a base layer and the intermediate layer, and where the base layer comprises a first material and the intermediate layer comprises a second material different than the first material. The method includes forming a first electrode and a second electrode in the sensor chamber. The method also includes forming a fluidic transport channel in fluid communication with the sensor chamber, where the fluidic transport channel comprises a third material different than the first material and the second material.
Public/Granted literature
- US20190127219A1 SUBSTRATE ASSEMBLY AND RELATED METHODS Public/Granted day:2019-05-02
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