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    SUBSTRATE ASSEMBLY AND RELATED METHODS
    2.
    发明申请
    SUBSTRATE ASSEMBLY AND RELATED METHODS 审中-公开

    公开(公告)号：US20190127219A1

    公开(公告)日：2019-05-02

    申请号：US16094411

    申请日：2016-07-22

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Sadiq Bengali ,  Manish Giri

    IPC: B81C1/00 ,  B81B1/00 ,  B01L3/00

    Abstract: Example sensor apparatus for microfluidic devices and related methods are disclosed. In examples disclosed herein, a method of fabricating a sensor apparatus for a microfluidic device includes etching a portion of an intermediate layer to form a sensor chamber in a substrate assembly, where the substrate assembly has a base layer and the intermediate layer, and where the base layer comprises a first material and the intermediate layer comprises a second material different than the first material. The method includes forming a first electrode and a second electrode in the sensor chamber. The method also includes forming a fluidic transport channel in fluid communication with the sensor chamber, where the fluidic transport channel comprises a third material different than the first material and the second material.

    Substrate assembly and related methods
    3.
    发明授权
    Substrate assembly and related methods 有权

    公开(公告)号：US11008214B2

    公开(公告)日：2021-05-18

    申请号：US16094411

    申请日：2016-07-22

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Sadiq Bengali ,  Manish Giri

    IPC: B81C1/00 ,  B01L3/00 ,  B81B1/00

    Abstract: Example sensor apparatus for microfluidic devices and related methods are disclosed. In examples disclosed herein, a method of fabricating a sensor apparatus for a microfluidic device includes etching a portion of an intermediate layer to form a sensor chamber in a substrate assembly, where the substrate assembly has a base layer and the intermediate layer, and where the base layer comprises a first material and the intermediate layer comprises a second material different than the first material. The method includes forming a first electrode and a second electrode in the sensor chamber. The method also includes forming a fluidic transport channel in fluid communication with the sensor chamber, where the fluidic transport channel comprises a third material different than the first material and the second material.

    Gold sensor
    6.
    发明授权
    Gold sensor 有权

    公开(公告)号：US10850275B2

    公开(公告)日：2020-12-01

    申请号：US15749036

    申请日：2016-01-29

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Sadiq Bengali ,  Manish Giri

    IPC: B01L3/00 ,  G01N33/553

    Abstract: A microfluidic diagnostic chip may, in an example, include a number of microfluidic channels defined in a substrate each microfluidic channel fluidly coupled to at least one fluidic slot; the at least one fluidic slot to receive a number of fluids, and a number of gold sensors each gold sensor having a thickness of between 1500 and 5000 angstroms (Å).

    FLUID DEVICE
    7.
    发明申请
    FLUID DEVICE 审中-公开

    公开(公告)号：US20180236765A1

    公开(公告)日：2018-08-23

    申请号：US15749067

    申请日：2016-01-25

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Manish Giri ,  Sadiq Bengali

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14153 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642

    Abstract: A device including a substrate and a channel formed in a layer disposed on the substrate. The layer includes a cavitation layer and a passivation layer to mitigate the effects of hydrodynamic cavitation on a surface of the channel. The passivation and cavitation material and thickness are optimized thermally to nucleate and eject a bubble at low voltages. A resistive heating element is disposed within the channel that is activated to create a micro-fluidic pump to advance a fluid through the channel. A sensor is disposed within the channel to measure a characteristic of the fluid passing through the channel.

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