- Patent Title: Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic device
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Application No.: US16015358Application Date: 2018-06-22
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Publication No.: US11009791B2Publication Date: 2021-05-18
- Inventor: Takamitsu Tomiga , Kenichi Harada , Shinichi Sugiyama , Fumihiro Yoshino , Shuji Hirano
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2015-255192 20151225,JPJP2016-179803 20160914
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/039 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/38
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition contains a resin (A) having a glass transition temperature of 155° C. or higher, a compound (B) having a glass transition temperature of 150° C. or lower, and a solvent (C). A solid content in the actinic ray-sensitive or radiation-sensitive resin composition is 20% by mass or more. A softening point of the resist pattern formed using the actinic ray-sensitive or radiation-sensitive resin composition is from 130° C. to 170° C.
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