There are provided system and method of segmentation a fabrication process (FP) image obtained in a fabrication of a semiconductor specimen. The method comprises: upon obtaining a Deep Neural Network (DNN) trained to provide segmentation-related data, processing a fabrication process (FP) sample using the obtained trained DNN and, resulting from the processing, obtaining by the computer segments-related data characterizing the FP image to be segmented, the obtained segments-related data usable for automated examination of the semiconductor specimen. The DNN is trained using a segmentation training set comprising a plurality of first training samples and ground truth data associated therewith, each first training sample comprises a training image; FP sample comprises the FP image to be segmented.