Method of deep learning-based examination of a semiconductor specimen and system thereof

    公开(公告)号:US11205119B2

    公开(公告)日:2021-12-21

    申请号:US15384058

    申请日:2016-12-19

    Abstract: There are provided system and method of examining a semiconductor specimen. The method comprises: upon obtaining a Deep Neural Network (DNN) trained for a given examination-related application within a semiconductor fabrication process, processing together one or more fabrication process (FP) images using the obtained trained DNN, wherein the DNN is trained using a training set comprising ground truth data specific for the given application; and obtaining examination-related data specific for the given application and characterizing at least one of the processed one or more FP images. The examination-related application can be, for example, classifying at least one defect presented by at least one FP image, segmenting the at least one FP image, detecting defects in the specimen presented by the at least one FP image, registering between at least two FP images, regression application enabling reconstructing the at least one FP image in correspondence with different examination modality, etc.

    Method of inspecting a specimen and system thereof

    公开(公告)号:US10928437B2

    公开(公告)日:2021-02-23

    申请号:US16582877

    申请日:2019-09-25

    Abstract: Data indicative of location information of a potential defect of interest revealed in a specimen and of one or more layers of the specimen corresponding to the potential defect of interest may be received. A die layout clip may be generated in accordance with the data by deriving the die layout clip based on the location information of the potential defect of interest and the one or more layers of the specimen corresponding to the potential defect of interest. The die layout clip may include information indicative of one or more patterns characterizing an inspection area that includes the potential defect of interest of the specimen. The generated die layout clip may be transmitted to a semiconductor inspection unit where an inspection by the semiconductor inspection unit of a semiconductor wafer that includes the specimen corresponding to the potential defect of interest is based on the one or more patterns of the die layout clip.

    Method of detecting defects in an object

    公开(公告)号:US10430938B2

    公开(公告)日:2019-10-01

    申请号:US15655796

    申请日:2017-07-20

    Abstract: A method, system, and computer program product of detecting defects in an object using a processor operatively connected to a memory, the method comprising: accommodating in the memory an image group comprising a reference image and an image; generating a set of correction parameters to be applied to pixels of an image from the image group, wherein the parameters are determined to minimize a combination of a first factor indicative of variability of the set, and a second factor indicative of a difference between an image from the image group as enhanced by applying the set and another image in the image group, wherein the combination increases as any factor increases; applying the set to the image of the image group to obtain an enhanced image; generating an optimal difference image between the enhanced image and the other image; and using the optimal difference image for detecting defect candidates.

    Method of deep learning-based examination of a semiconductor specimen and system thereof

    公开(公告)号:US11348001B2

    公开(公告)日:2022-05-31

    申请号:US15675477

    申请日:2017-08-11

    Abstract: There are provided system and method of classifying defects in a semiconductor specimen. The method comprises: upon obtaining by a computer a Deep Neural Network (DNN) trained to provide classification-related attributes enabling minimal defect classification error, processing a fabrication process (FP) sample using the obtained trained DNN; and, resulting from the processing, obtaining by the computer classification-related attributes characterizing the at least one defect to be classified, thereby enabling automated classification, in accordance with the obtained classification-related attributes, of the at least one defect presented in the FP image. The DNN is trained using a classification training set comprising a plurality of first training samples and ground truth data associated therewith, each first training sample comprising a training image presenting at least one defect and the ground truth data is informative of classes and/or class distribution of defects presented in the respective first training samples; the FP sample comprises a FP image presenting at least one defect to be classified.

    Registration between an image of an object and a description

    公开(公告)号:US10902620B1

    公开(公告)日:2021-01-26

    申请号:US16388416

    申请日:2019-04-18

    Abstract: An apparatus, method and non-transitory computer readable storage medium for registering between an image and a description of a multi-layer object, the apparatus comprising: a memory for storing an image of the object and at least part of the description, the part comprising a first description of a first layer and a second description of a second layer of the object; and a processor operatively connected to the memory for: matching the first description to a first part of the image, the first part informative of a part of the first layer, thereby determining a first matching offset; matching the second description to a second part of the image, the second part informative of a part of the second layer, thereby determining a second matching offset; and registering between the image and the description of the multi-layer object based on the at least on the first and second matching offsets.

    Method of performing metrology operations and system thereof

    公开(公告)号:US10571406B2

    公开(公告)日:2020-02-25

    申请号:US16179700

    申请日:2018-11-02

    Abstract: One or more metrology objects and one or more metrology operations may be identified. A design-based representation of a first metrology object of the one or more metrology objects may be received. Furthermore, an image-based representation of the first metrology object of the one or more metrology objects may be received where the one or more metrology operations include a first metrology operation associated with the first metrology object that is to be performed on the image-based representation of the first metrology object. The design-based representation of the first metrology object may be mapped with the image-based representation of the first metrology object. The first metrology operation may be performed based on the mapping.

    Method of performing metrology operations and system thereof

    公开(公告)号:US10120973B2

    公开(公告)日:2018-11-06

    申请号:US15460078

    申请日:2017-03-15

    Abstract: There are provided system and method of performing metrology operations related to a specimen. The method comprises: accommodating definitions of metrology objects and metrology operations, at least one of the group consisting of the metrology objects and the metrology operations being defined using design data; accommodating a design-based representation and an image-based representation of the specimen, the design-based representation of the specimen comprising design-based representation of at least first metrology object, the image-based representation of the specimen comprising image-based representation of the at least first metrology object, the metrology operations including at least first metrology operation defined as related to the at least first metrology object and performed on at least the image-based representation of the specimen; mapping between the design-based representation and the image-based representation of the at least first metrology object; and performing the at least first metrology operation according to definition thereof using the mapping.

    Method of inspecting a specimen and system thereof

    公开(公告)号:US10545490B2

    公开(公告)日:2020-01-28

    申请号:US14727800

    申请日:2015-06-01

    Abstract: There are provided a method of generating an inspection recipe usable for inspecting an inspection area of a specimen and a recipe generating unit. The recipe generating unit is configured: upon obtaining design data informative of design structural elements comprised in a design PoI corresponding to the at least one PoI, to provide global segmentation of a test image captured by an inspection tool unit from the inspection area and comprising at least one test PoI of substantially the same design as the at least one PoI, thereby to obtain segmented structural elements comprised in the test PoI and segmentation configuration data; to associate the segmented structural elements comprised in the test PoI with the design structural elements comprised in the design PoI, thereby to obtain design association data; and to generate an inspection recipe comprising, at least, segmentation configuration data and design association data.

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