Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US15497314Application Date: 2017-04-26
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Publication No.: US11011294B2Publication Date: 2021-05-18
- Inventor: Shinichi Sato , Yohei Tadaki , Akihiko Oide , Yuma Ishikawa , Hidekazu Sato
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2016-095421 20160511
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/245 ; H01F27/02 ; H01F17/00 ; H01F27/29 ; H01F17/04 ; H01F27/255 ; H01F27/28 ; H01F27/32 ; H01F41/12 ; H01F41/04

Abstract:
A multilayer coil component includes an element body made of a ferrite sintered body and a coil. The coil is configured with a plurality of internal conductors juxtaposed in the element body and electrically connected to one another. An average crystal grain size in a surface region of the element body is smaller than an average crystal grain size in a region between the internal conductors in the element body. A surface of the element body is covered with a layer made of an insulating material. The insulating material is not present among the crystal grains in the surface region of the element body.
Public/Granted literature
- US20170330673A1 MULTILAYER COIL COMPONENT Public/Granted day:2017-11-16
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