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    Electronic component
    1.
    发明授权
    Electronic component 有权

    公开(公告)号：US11482371B2

    公开(公告)日：2022-10-25

    申请号：US16715245

    申请日：2019-12-16

    Applicant: TDK CORPORATION

    Inventor： Shinichi Sato ,  Yohei Tadaki ,  Akihiko Oide ,  Yuma Ishikawa ,  Hidekazu Sato ,  Kazuhiro Ebina ,  Hiroyuki Tanoue

    IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

    Multilayer inductor component
    4.
    发明授权
    Multilayer inductor component 有权

    公开(公告)号：US12125627B2

    公开(公告)日：2024-10-22

    申请号：US17337985

    申请日：2021-06-03

    Applicant: TDK CORPORATION

    Inventor： Daiki Kato ,  Masashi Shimoyasu ,  Yoji Tozawa ,  Seiichi Nakagawa ,  Akihiko Oide ,  Makoto Yoshino ,  Kazuhiro Ebina

    IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

    CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F41/041 ,  H01F2027/2809

    Abstract: A multilayer conductor component includes an element body, an internal conductor, and an external electrode. The external electrode includes a sintered metal layer. The sintered metal layer is disposed on an end surface, a pair of side surfaces, a first main surface, and a second main surface of the element body. An electrode length, which is a length in the first direction from an edge of the sintered metal layer to a reference plane including the end surface, at a central portion of the first main surface in the third direction, is shorter than the electrode length at each of the ridge portions. The electrode length at a central portion of each of the pair of side surfaces in the second direction is equal to or less than the electrode length at each of the ridge portions.

    Electronic component
    6.
    发明授权
    Electronic component 有权

    公开(公告)号：US12224104B2

    公开(公告)日：2025-02-11

    申请号：US17945396

    申请日：2022-09-15

    Applicant: TDK CORPORATION

    Inventor： Shinichi Sato ,  Yohei Tadaki ,  Akihiko Oide ,  Yuma Ishikawa ,  Hidekazu Sato ,  Kazuhiro Ebina ,  Hiroyuki Tanoue

    IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

    Electronic component
    8.
    发明授权
    Electronic component 有权

    公开(公告)号：US10541078B2

    公开(公告)日：2020-01-21

    申请号：US15488876

    申请日：2017-04-17

    Applicant: TDK CORPORATION

    Inventor： Shinichi Sato ,  Yohei Tadaki ,  Akihiko Oide ,  Yuma Ishikawa ,  Hidekazu Sato ,  Kazuhiro Ebina ,  Hiroyuki Tanoue

    IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

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