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    Electronic component
    1.
    发明授权
    Electronic component 有权

    公开(公告)号：US11482371B2

    公开(公告)日：2022-10-25

    申请号：US16715245

    申请日：2019-12-16

    Applicant: TDK CORPORATION

    Inventor： Shinichi Sato ,  Yohei Tadaki ,  Akihiko Oide ,  Yuma Ishikawa ,  Hidekazu Sato ,  Kazuhiro Ebina ,  Hiroyuki Tanoue

    IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

    Multilayer coil component
    2.
    发明授权
    Multilayer coil component 有权

    公开(公告)号：US11211188B2

    公开(公告)日：2021-12-28

    申请号：US16136944

    申请日：2018-09-20

    Applicant: TDK CORPORATION

    Inventor： Yusuke Nagai ,  Takashi Suzuki ,  Hidekazu Sato ,  Takashi Endo ,  Kouichi Kakuda ,  Kunihiko Kawasaki ,  Shinichi Kondo ,  Yuya Ishima ,  Shinichi Sato ,  Masaki Takahashi

    IPC: H01F17/00 ,  H01F17/04 ,  H01F27/34 ,  H01F41/04 ,  H01F27/29

    Abstract: In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.

    Electronic component
    4.
    发明授权
    Electronic component 有权

    公开(公告)号：US11631521B2

    公开(公告)日：2023-04-18

    申请号：US16396913

    申请日：2019-04-29

    Applicant: TDK CORPORATION

    Inventor： Yoji Tozawa ,  Takuo Abe ,  Yuma Ishikawa ,  Hidekazu Sato ,  Takashi Endo ,  Masashi Shimoyasu ,  Kazuma Takahashi

    IPC: H01F27/28 ,  H03H1/00 ,  H03H7/09 ,  H01F41/04 ,  H01F27/29

    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.

    Multilayer coil component
    5.
    发明授权
    Multilayer coil component 有权

    公开(公告)号：US10984939B2

    公开(公告)日：2021-04-20

    申请号：US15419522

    申请日：2017-01-30

    Applicant: TDK CORPORATION

    Inventor： Takashi Endo ,  Kenji Komorita ,  Kunihiko Kawasaki ,  Hidekazu Sato ,  Takashi Suzuki

    IPC: H01F5/00 ,  H01F17/00

    Abstract: A multilayer coil component includes an element body, a coil including a plurality of internal conductors, and a plurality of stress-relaxation spaces. The plurality of internal conductors are separated from each other in a first direction in the element body. Each stress-relaxation space is in contact with a surface of the corresponding internal conductor and powders exist in each stress-relaxation space. The element body includes element body regions located between the internal conductors adjacent to each other in the first direction. Each stress-relaxation space includes a first boundary surface with each internal conductor and a second boundary surface with each element body region. The first boundary surface and the second boundary surface oppose each other in the first direction. A distance between the first boundary surface and the second boundary surface is smaller than a thickness of each element body region in the first direction.

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