- Patent Title: Semiconductor device packages and methods of manufacturing the same
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Application No.: US16563701Application Date: 2019-09-06
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Publication No.: US11011491B2Publication Date: 2021-05-18
- Inventor: Shun-Tsat Tu , Pei-Jen Lo , Fong Ren Sie , Cheng-En Weng , Min Lung Huang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Larder LLP
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A semiconductor device package includes a connection structure having a first portion and a second portion extending from the first portion, the second portion having a width less than the first portion; and a dielectric layer surrounding the connection structure, wherein the dielectric layer and the second portion of the connection structure defines a space.
Public/Granted literature
- US20210074669A1 SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2021-03-11
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