公开(公告)号：US11594506B2

公开(公告)日：2023-02-28

申请号：US17030181

申请日：2020-09-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pei-Jen Lo ,  Shun-Tsat Tu ,  Cheng-En Weng

IPC: H01L23/00

Abstract: A semiconductor package is provided. The semiconductor package includes a first conductive layer, a plurality of first conductive pads, a plurality of second conductive pads, and a first dielectric layer. The first conductive pads are electrically connected to the first conductive layer. The second conductive pads are electrically disconnected from the first conductive layer.

公开(公告)号：US11011491B2

公开(公告)日：2021-05-18

申请号：US16563701

申请日：2019-09-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shun-Tsat Tu ,  Pei-Jen Lo ,  Fong Ren Sie ,  Cheng-En Weng ,  Min Lung Huang

IPC: H01L23/00

Abstract: A semiconductor device package includes a connection structure having a first portion and a second portion extending from the first portion, the second portion having a width less than the first portion; and a dielectric layer surrounding the connection structure, wherein the dielectric layer and the second portion of the connection structure defines a space.