Invention Grant
- Patent Title: Thickness measurement of substrate using color metrology
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Application No.: US16435291Application Date: 2019-06-07
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Publication No.: US11017524B2Publication Date: 2021-05-25
- Inventor: Dominic J. Benvegnu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/90 ; B24B37/013 ; H01L21/67 ; H01L21/677 ; H04N5/225 ; H04N9/07

Abstract:
A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.
Public/Granted literature
- US20190295239A1 THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY Public/Granted day:2019-09-26
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