Various embodiments may provide a semiconductor package. The semiconductor package may include a routing layer including a plurality of first layer contact elements on a first side and a plurality of second layer contact elements on a second side opposite the first side, and a first semiconductor die including a plurality of first electrical die contact elements coupled to the plurality of first layer contact elements. The semiconductor package may further include a second semiconductor die including a plurality of second electrical die contact elements coupled to the plurality of second layer contact elements, and a mold structure covering the second semiconductor die. A first pitch between neighbouring first electrical die contact elements may be greater than a second pitch between neighbouring second electrical die contact elements.