公开(公告)号：US11018080B2

公开(公告)日：2021-05-25

申请号：US16087621

申请日：2017-03-17

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Roshan Weerasekera ,  Surya Bhattacharya ,  Ka Fai Chang ,  Vempati Srinivasa Rao

IPC: H01L23/498 ,  H01L23/538 ,  H01L21/48 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00

Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a routing layer including a plurality of first layer contact elements on a first side and a plurality of second layer contact elements on a second side opposite the first side, and a first semiconductor die including a plurality of first electrical die contact elements coupled to the plurality of first layer contact elements. The semiconductor package may further include a second semiconductor die including a plurality of second electrical die contact elements coupled to the plurality of second layer contact elements, and a mold structure covering the second semiconductor die. A first pitch between neighbouring first electrical die contact elements may be greater than a second pitch between neighbouring second electrical die contact elements.