Invention Grant
- Patent Title: Gas injectors and wafer processing apparatuses having the same
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Application No.: US16212036Application Date: 2018-12-06
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Publication No.: US11021796B2Publication Date: 2021-06-01
- Inventor: Jong-Hyun Lee , Young-Kwon Kim , Woo-Jae Kim , Seung-Min Ryu , Ji-Ho Uh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2018-0047714 20180425
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C16/52 ; C23C16/455 ; C23C16/02 ; H01L21/673

Abstract:
A gas injector includes first and second gas introduction passages extending in a first direction toward a central axis of a process chamber respectively, a first bypass passage extending from the first gas introduction passage in a second direction that is substantially perpendicular to the first direction, a second bypass passage extending from the second gas introduction passage in a reverse direction to the second direction, a first distribution passage isolated from the first bypass passage in the first direction and extending from an outlet of the first bypass passage in the reverse direction to the second direction, a second distribution passage isolated from the second bypass passage in the first direction and extending from an outlet of the second bypass passage in the second direction, and a plurality of spray holes in an outer surface of the first and second distribution passages and configured to spray the process gas.
Public/Granted literature
- US20190330741A1 GAS INJECTORS AND WAFER PROCESSING APPARATUSES HAVING THE SAME Public/Granted day:2019-10-31
Information query
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