- 专利标题: Temperature correction in memory sub-systems
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申请号: US16909503申请日: 2020-06-23
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公开(公告)号: US11023177B2公开(公告)日: 2021-06-01
- 发明人: Gianni Stephen Alsasua , Karl D. Schuh , Ashutosh Malshe , Kishore Kumar Muchherla , Vamsi Pavan Rayaprolu , Sampath Ratnam , Harish Reddy Singidi , Renato Padilla, Jr.
- 申请人: Micron Technology, Inc.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Schwegman Lundberg & Woessner, P.A.
- 主分类号: G11C16/04
- IPC分类号: G11C16/04 ; G06F3/06 ; G06F12/1009 ; G11C16/34 ; G11C16/26
摘要:
A memory device may receive a read request describing a logical address at the memory device. The memory device may obtain a table entry associated with the logical address. The table entry comprises a physical address corresponding to the logical address and a write temperature data indicating a write temperature for the logical address. The memory device may determine a corrected threshold voltage for reading the physical address based at least in part on the write temperature data and read the physical address using the corrected threshold voltage.
公开/授权文献
- US20200319827A1 TEMPERATURE CORRECTION IN MEMORY SUB-SYSTEMS 公开/授权日:2020-10-08
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