- 专利标题： Resonance apparatus for processing electrical loss using conductive material and method for manufacturing the same
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申请号： US16871316申请日： 2020-05-11
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公开(公告)号： US11025225B2公开(公告)日： 2021-06-01
- 发明人: Hosoo Park , Duck Hwan Kim , Chul Soo Kim , Sang Uk Son , In Sang Song , Jeashik Shin , Moonchul Lee
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 代理机构： NSIP Law
- 优先权： KR10-2012-0100437 20120911
- 主分类号： H03H9/54
- IPC分类号： H03H9/54 ; H01L41/047 ; H01L41/29 ; H03H9/02 ; H03H9/13 ; H03H9/17
摘要：
A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The resonance apparatus includes a lower electrode formed at a predetermined distance from a substrate, and a piezoelectric layer formed on the lower electrode. The resonance apparatus further includes an upper electrode formed on the piezoelectric layer, and a conductive layer formed on the upper electrode or the lower electrode.
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