Invention Grant
- Patent Title: Compression of high dynamic ratio fields for machine learning
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Application No.: US16798186Application Date: 2020-02-21
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Publication No.: US11025271B2Publication Date: 2021-06-01
- Inventor: Clara Ka Wah Sung , Meghal Varia , Serag Gadelrab , Cheng-Teh Hsieh , Jason Edward Podaima , Victor Szeto , Richard Boisjoly , Milivoje Aleksic , Tom Longo , In-Suk Chong
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: The Marbury Law Group
- Main IPC: H03M7/00
- IPC: H03M7/00 ; H03M7/30 ; G06F17/18 ; G06N20/00 ; G06N5/04 ; G06F13/28
Abstract:
Various embodiments include methods and devices for implementing compression of high dynamic ratio fields. Various embodiments may include receiving a compression block having data units, receiving a mapping for the compression block, wherein the mapping is configured to map bits of each data unit to two or more data fields to generate a first set of data fields and a second set of data fields, compressing the first set of data fields together to generate a compressed first set of data fields, and compressing the second set of data fields together to generate a compressed second set of data fields.
Public/Granted literature
- US20200274549A1 Compression Of High Dynamic Ratio Fields For Machine Learning Public/Granted day:2020-08-27
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