A clothes care apparatus capable of improving cooling performance of a printed circuit board assembly includes a body, a first chamber provided inside the body and configured to receive clothes, a second chamber provided inside the body but separated from the first chamber, a printed circuit board housing configured to form one side wall of the second chamber and provided with a receiving space separated from the second chamber in the second chamber, the receiving space to which air outside the body flows, and a printed circuit board assembly arranged in the receiving space to be cooled by air flowing into the receiving space from the outside of the body.