Invention Grant
- Patent Title: Frame lid for in-package optics
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Application No.: US16522531Application Date: 2019-07-25
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Publication No.: US11029475B2Publication Date: 2021-06-08
- Inventor: Vipulkumar K. Patel , Aparna R. Prasad , Sandeep Razdan
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
The present disclosure provides a frame lid assembly, which may be used in assembling an optical platform to provide isolated thermal conduction paths for various elements thereof. The frame lid assembly includes a first frame lid, including: a foot, disposed in a first plane; a roof, disposed in a second plane parallel to the first plane, the roof defining a port as a first through-hole that is perpendicular to the second plane; a wall, disposed obliquely to the first plane, separating the roof from the foot, the wall defining a slot as a second through-hole that is parallel to the first plane; a second frame lid connected to the first frame lid and thermally isolated from the first frame lid, the second frame lid including: a cap, connected to the roof via a thermal insulator; and a plug, extending perpendicularly from the cap through the port.
Public/Granted literature
- US20200319416A1 FRAME LID FOR IN-PACKAGE OPTICS Public/Granted day:2020-10-08
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