- 专利标题: Leakage analysis on semiconductor device
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申请号: US16586658申请日: 2019-09-27
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公开(公告)号: US11030381B2公开(公告)日: 2021-06-08
- 发明人: Cheng-Hua Liu , Yun-Xiang Lin , Yuan-Te Hou , Chung-Hsing Wang
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Maschoff Brennan
- 主分类号: G06F30/398
- IPC分类号: G06F30/398 ; G06F30/367 ; G06F30/20 ; G06F30/39 ; G06F119/10 ; G06F30/392 ; G06F119/18 ; G06F111/20
摘要:
A method is utilized to calculate a boundary leakage in a semiconductor device. A boundary is detected between a first cell and a second cell, which the first cell and the second cell are abutted to each other around the boundary. Attributes associated with cell edges of the first cell and the second cell are identified. A cell abutment case is identified based on the attributes associated with the cell edges of the first cell and the second cell. An expected boundary leakage between the first cell and the second cell is calculated based on leakage current values associated with the cell abutment case and leakage probabilities associated with the cell abutment case.
公开/授权文献
- US20200226229A1 LEAKAGE ANALYSIS ON SEMICONDUCTOR DEVICE 公开/授权日:2020-07-16
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