Invention Grant
- Patent Title: Lead frame for improving adhesive fillets on semiconductor die corners
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Application No.: US16264824Application Date: 2019-02-01
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Publication No.: US11037864B2Publication Date: 2021-06-15
- Inventor: Rennier Rodriguez , Maiden Grace Maming , Jefferson Talledo
- Applicant: STMicroelectronics, Inc.
- Applicant Address: PH Calamba
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: PH Calamba
- Agency: Seed IP Law Group LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L23/00
Abstract:
The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.
Public/Granted literature
- US20190267310A1 LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS Public/Granted day:2019-08-29
Information query
IPC分类:
