- 专利标题: MEMS-based bone conduction sensor
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申请号: US16661326申请日: 2019-10-23
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公开(公告)号: US11039254B2公开(公告)日: 2021-06-15
- 发明人: Jinghua Ye
- 申请人: ZILLTEK TECHNOLOGY (SHANGHAI) CORP. , ZILLTEK TECHNOLOGY CORP.
- 申请人地址: CN Shanghai; TW Hsinchu
- 专利权人: ZILLTEK TECHNOLOGY (SHANGHAI) CORP.,ZILLTEK TECHNOLOGY CORP.
- 当前专利权人: ZILLTEK TECHNOLOGY (SHANGHAI) CORP.,ZILLTEK TECHNOLOGY CORP.
- 当前专利权人地址: CN Shanghai; TW Hsinchu
- 代理机构: Calfee Halter & Griswold LLP
- 优先权: CN201910173096.4 20190307
- 主分类号: A61F11/06
- IPC分类号: A61F11/06 ; H04R19/02 ; G10K11/178 ; G10L19/00 ; H04R1/10 ; H04R3/00 ; H04R1/40
摘要:
The invention relates to the field of electronic technology, and more particularly, to a microphone structure. A MEMS (Micro-Electro-Mechanical System)-based bone conduction sensor comprises: a closed cavity within which a uniaxial or biaxial accelerometer sensor is arranged to be adjacent to bones of a human ear; an ASIC (application-specific integrated circuit) processing chip coupled to the uniaxial or biaxial accelerometer sensor, the ASIC processing chip being provided with an output end for a vibration signal. By adopting the above-mentioned technical solution, a bone conduction sensor with a closed cavity is provided in the present invention. Furthermore, a uniaxial or biaxial accelerometer sensor and an ASIC processing chip are arranged inside the closed cavity. In this way, the production costs are reduced, and interference of the sensor caused by ambient environment is reduced.
公开/授权文献
- US20200288250A1 MEMS-BASED BONE CONDUCTION SENSOR 公开/授权日:2020-09-10
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