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公开(公告)号：US20220070569A1
公开(公告)日：2022-03-03
申请号：US17094371
申请日：2020-11-10
发明人： Jinghua Ye
摘要： A water-proof microphone is provided in embodiments of the present invention, comprising: a substrate on which microphone components are mounted; a packaging housing arranged on top of the substrate; a plurality of water-proof sound apertures being formed on the packaging housing; wherein the packaging housing is connected to the substrate in a leak-tight manner. In the present invention, a plurality of water-proof sound apertures are formed on the packaging housing of the microphone, and the water-proof sound apertures prevent water drops from entering the interior of the microphone while allowing sound signals enter the microphone. Water tension may prevent the water drops from entering the microphone through the sound apertures. In this way, the microphone is resistant to water and its acoustic performance is not affected. In addition, since there is no need for the provision of the water-proof membranes, a simpler structure is obtained, and costs are reduced.
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公开(公告)号：US10542349B2
公开(公告)日：2020-01-21
申请号：US15992858
申请日：2018-05-30
发明人： Jinghua Ye
摘要： The invention relates to the field of micro-electromechanical technology, and more particularly, to a microphone structure with an enhanced back cavity and an electronic device, comprising: a first layer plate, an groove is configured on the first layer plate, wherein an acoustic sensor is installed above the groove by means of a support, and the acoustic sensor is provided with a back cavity facing towards the support, and a through-hole for penetrating through the back cavity and the groove is provided on the support; a second layer plate, covering the first layer plate, wherein an acoustic through-hole is configured on the second layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity. The beneficial effects of the technical solutions of the invention are as follows: a microphone structure with an enhanced back cavity and an electronic device is disclosed, which boasts low cost and simple manufacturing process, wherein the volume of the back cavity is effectively enlarged, the sensitivity inside of the microphone structure is enhanced, and the acoustic performance of the microphone structure is improved, such that the tone quality received by the electronic product becomes better.
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3.发明申请公开(公告)号：US20160366767A1
公开(公告)日：2016-12-15
申请号：US14937076
申请日：2015-11-10
发明人： Jinghua Ye
CPC分类号： H05K3/0058 , H04R1/44 , H04R2201/003 , H05K1/0272 , H05K1/0298 , H05K1/144 , H05K3/4626 , H05K3/4638 , H05K3/4644 , H05K3/4697 , H05K2201/042 , H05K2201/09063 , H05K2201/096 , H05K2201/10083
摘要： The present invention relates to the field of voice signal collecting device, more specifically, to a PCB, a waterproof microphone and a production process thereof. A waterproof microphone, comprising: a first PCB; a second PCB, stacked along two parallel ends of the first PCB; a third PCB, configured with an acoustics through-hole and located at an upper end of the second PCB; wherein, an acoustics cavity is formed at a space surrounded with the first PCB, the second PCB and the third PCB; the third PCB is formed by a plurality of substrate; each of the substrates is configured with an through-hole at same location and with same shape; an opening is formed on the PCB by interconnecting the through-holes; between every two adjacent ones of the substrate, a waterproof membrane is configured. The waterproof performance of the waterproof membrane is better, and the efficiency of the attachment is higher.
摘要翻译： 本发明涉及语音信号采集装置领域，更具体地涉及一种PCB，一种防水麦克风及其制造方法。 一种防水麦克风，包括：第一PCB; 第二PCB，沿第一PCB的两个平行端堆叠; 第三PCB，配置有声学通孔并且位于第二PCB的上端; 其中，在由所述第一PCB，所述第二PCB和所述第三PCB围绕的空间处形成声学空腔; 第三PCB由多个基板形成; 每个基板在相同位置和相同形状上构造有通孔; 通过互连通孔在PCB上形成开口; 在基板的每两个相邻的基板之间，配置防水膜。 防水膜的防水性能更好，附件效率更高。
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公开(公告)号：US10484799B1
公开(公告)日：2019-11-19
申请号：US16142602
申请日：2018-09-26
发明人： Jinghua Ye
摘要： A photoelectric MEMS microphone and an electronic device, have an acoustic cavity, the acoustic cavity includes a MEMS transducer, configured for capturing an acoustic signal, a signal processing chip, connected to a signal output terminal of the MEMS transducer. The signal processing chip includes a signal output terminal pin and a ground pin, and a light emitting device, a driving terminal of the light emitting device being connected to the signal output terminal pin. The light emitting device packaged in the microphone cavity provides the user indication that the microphone of the terminal device is turned on, avoiding the exposure of personal privacy. Furthermore, it helps to reduce costs in that the signal output terminal pin and the ground pin are integrated into the microphone.
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公开(公告)号：US10341769B1
公开(公告)日：2019-07-02
申请号：US15974327
申请日：2018-05-08
发明人： Jinghua Ye
摘要： A sound amplification system integrated with back cavity pressure sensing, including: a loudspeaker body, including: a vibrating diaphragm, a voice coil connected with the vibrating diaphragm, and a back cavity, wherein the voice coil is connected to a driving unit, a microphone is in the back cavity, and the microphone senses an internal pressure of the back cavity; a computing unit, making an estimation of a displacement of the vibrating diaphragm based on the internal pressure; and a processing unit, determining the displacement of the vibrating diaphragm when compared with a reference displacement, when it is determined that the displacement exceeds a set threshold, a pre-compensation signal is generated and provided to the driving unit.
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公开(公告)号：US09936584B2
公开(公告)日：2018-04-03
申请号：US14937076
申请日：2015-11-10
发明人： Jinghua Ye
CPC分类号： H05K3/0058 , H04R1/44 , H04R2201/003 , H05K1/0272 , H05K1/0298 , H05K1/144 , H05K3/4626 , H05K3/4638 , H05K3/4644 , H05K3/4697 , H05K2201/042 , H05K2201/09063 , H05K2201/096 , H05K2201/10083
摘要： The present invention relates to the field of voice signal collecting device, more specifically, to a PCB, a waterproof microphone and a production process thereof. A waterproof microphone, comprising: a first PCB; a second PCB, stacked along two parallel ends of the first PCB; a third PCB, configured with an acoustics through-hole and located at an upper end of the second PCB; wherein, an acoustics cavity is formed at a space surrounded with the first PCB, the second PCB and the third PCB; the third PCB is formed by a plurality of substrate; each of the substrates is configured with an through-hole at same location and with same shape; an opening is formed on the PCB by interconnecting the through-holes; between every two adjacent ones of the substrate, a waterproof membrane is configured. The waterproof performance of the waterproof membrane is better, and the efficiency of the attachment is higher.
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公开(公告)号：US11856364B2
公开(公告)日：2023-12-26
申请号：US17665041
申请日：2022-02-04
发明人： Jinghua Ye
IPC分类号： H04R1/40 , H04R3/00 , G10L21/0216
CPC分类号： H04R1/406 , H04R3/005 , G10L2021/02166 , H04R2201/401
摘要： A microphone array system, comprises N microphones, including a first microphone . . . a Nth microphone, wherein N is a natural number greater than 2. Each of the N microphones is provided with: an acoustic transducer for picking up a sound signal and converting the sound signal into an electric signal; a voice activation detector, connected to a corresponding acoustic transducer, and configured to perform a voice activation detection on the electric signal and form an activation signal; a buffer memory, connected to the acoustic transducer, and configured to store a 1/N electric signal of a predetermined segment; a sound wire interface, connected to a corresponding acoustic transducer, the buffer memory, and the voice activation detector, wherein the sound wire interface is connected to an external master chip via a sound wire bus for outputting the activation signal to the external master chip.
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公开(公告)号：US11172279B1
公开(公告)日：2021-11-09
申请号：US17094060
申请日：2020-11-10
发明人： Jinghua Ye
IPC分类号： H04R1/08
摘要： A microphone with a combined packaging structure includes: a substrate, a first cover being provided on top of the substrate, the substrate, together with the first cover, forms a first accommodating cavity, an acoustic sensor being provided inside the first accommodating cavity, and an acoustic through-hole being formed in the first accommodating cavity. A second cover is provided on a back face of the substrate, the second cover, together with the substrate, forms a second accommodating cavity, and a proximity sensor is arranged inside the second accommodating cavity. By adopting the above-mentioned technical solutions, the present invention has the beneficial effects that two accommodating cavities are respectively provided on the top and bottom of the substrate in the microphone according to the present invention, for receiving components of a MEMS microphone and the components of a proximity sensor respectively.
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公开(公告)号：US10863283B2
公开(公告)日：2020-12-08
申请号：US16509768
申请日：2019-07-12
发明人： Jinghua Ye
摘要： A MEMS microphone for a frame-free device, comprising a substrate, wherein the substrate comprises a first substrate region provided with an acoustic sensor, an ASIC chip, and a MEMS chip, and a second substrate region provided with a plurality of pads; both the first substrate region and the second substrate region are disposed at the same side of the substrate; an acoustic through-hole is disposed at the back of the first substrate region; a microphone connection structure further comprises a flexible circuit board, wherein the flexible circuit board electrically connects the plurality of pads of the MEMS microphone to a circuit board of the frame-free device; the acoustic through-hole is aligned with an acoustic opening of the frame-free device; by adopting the MEMS microphone for a frame-free device, the MEMS microphone may be more widely used in many high-tech industries and has better acoustic performance over the conventional MEMS microphone.
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公开(公告)号：US10448134B1
公开(公告)日：2019-10-15
申请号：US15991787
申请日：2018-05-29
发明人： Jinghua Ye
摘要： The invention discloses a two-wire type microphone with ultrasonic identification, comprising: an acoustic transducer for capturing an acoustic signal; a signal processing chip, connected to a signal output terminal of the acoustic transducer, wherein the signal processing chip comprises a signal output terminal pin, a ground pin and an ultrasonic generator, wherein the ultrasonic generator is the configured for generating an ultrasonic signal, and a control terminal of the ultrasonic generator is connected to the signal processing chip. The beneficial effects of the present invention includes: the ultrasonic signal generated by the ultrasonic generator is utilized to match the ultrasonic signal with the encoding unit in the signal processing chip for identification, and a remote authentication by the client is useful for matching the electronic device with the microphone. Furthermore, the signal output terminal pin and the ground pin are introduced into the microphone in the prior art, and the signal output terminal pin is also used for a communication line and a power line, thereby further saving the cost.
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