Invention Grant
- Patent Title: Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
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Application No.: US15757896Application Date: 2016-09-07
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Publication No.: US11040416B2Publication Date: 2021-06-22
- Inventor: Dai Ishikawa , Yuki Kawana , Chie Sugama , Hideo Nakako , Yoshinori Ejiri , Kazuhiko Kurafuchi
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery. LLP
- Priority: JPJP2015-176070 20150907
- International Application: PCT/JP2016/076333 WO 20160907
- International Announcement: WO2017/043541 WO 20170316
- Main IPC: B23K35/30
- IPC: B23K35/30 ; B23K35/02 ; B22F7/08 ; H01L23/00 ; B22F7/06

Abstract:
Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 μm to 0.8 μm, and flake-shaped micro copper particles having a maximum particle size of 1 μm to 20 μm, and an aspect ratio of 4 or greater, and the amount of the micro copper particles contained, which are included in the metal particles and have a maximum particle size of 1 μm to 20 μm and an aspect ratio of less than 2, is 50% by mass or less on the basis of a total amount of the flake-shaped micro copper particles.
Information query
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