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公开(公告)号：US11930594B2
公开(公告)日：2024-03-12
申请号：US16325493
申请日：2016-08-15
发明人： Aya Kasahara , Yasuyuki Mizuno , Hikari Murai
IPC分类号： H05K1/03 , C09J163/00 , H05K3/38 , H05K3/46
CPC分类号： H05K1/0373 , C09J163/00 , H05K3/38 , H05K3/4626 , C09J163/00 , C08L61/06 , C08K3/36
摘要： The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when silica filler is highly filled. Specifically, there is provided an adhesive film for a multilayer printed-wiring board, which includes a resin composition layer that is obtained by forming a layer of a resin composition containing: (A) a novolac type phenolic resin in which a dispersity (Mw/Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) ranges from 1.05 to 1.8; (B) an epoxy resin represented by general formula (1); and (C) inorganic filler, on a support film. An average particle size of the (C) inorganic filler in the resin composition layer is 0.1 μm or more, and a content of the (C) inorganic filler in a resin solid content ranges from 20% to 95% by mass.
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公开(公告)号：US11908762B2
公开(公告)日：2024-02-20
申请号：US16979678
申请日：2019-03-01
发明人： Naoki Tomori , Tomohiro Nagoya , Takahiro Kuroda
IPC分类号： C09J7/29 , H01L23/31 , C09J7/38 , H01L21/56 , H01L23/495 , B32B7/027 , C09J201/02
CPC分类号： H01L23/3142 , B32B7/027 , C09J7/29 , C09J7/38 , H01L21/561 , H01L23/49579 , C09J201/02
摘要： A temporary protective film comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film is disclosed. The coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film may be greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film.
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公开(公告)号：US11887960B2
公开(公告)日：2024-01-30
申请号：US16757798
申请日：2018-10-23
发明人： Motohiro Negishi , Hideo Nakako , Yuki Kawana , Dai Ishikawa , Chie Sugama , Yoshinori Ejiri
IPC分类号： H01L23/00 , B22F7/06 , B22F7/08 , B23K35/02 , B23K35/30 , B22F1/05 , B22F1/107 , B22F7/04 , B22F1/102 , B22F1/052
CPC分类号： H01L24/29 , B22F1/05 , B22F1/107 , B22F7/064 , B22F7/08 , B23K35/025 , B23K35/302 , H01L24/83 , B22F1/052 , B22F1/102 , B22F2007/047 , B22F2301/10 , B22F2304/10 , B22F2998/10 , H01L2224/29013 , H01L2224/29247 , H01L2224/8384 , B22F2998/00 , B22F1/068 , B22F1/065 , B22F2999/00 , B22F1/107 , C22C1/0425 , B22F2007/047
摘要： This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.
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公开(公告)号：US11854919B2
公开(公告)日：2023-12-26
申请号：US16305285
申请日：2017-05-29
发明人： Dongchul Kang , Takahiro Horie , Kenta Ishibashi , Naoki Namai , Kazuhide Sekiguchi , Keichi Hori
CPC分类号： H01L23/295 , C08K3/26 , C08L63/00 , C08K2003/222 , C08K2003/2227 , C08L2203/206 , C08L2205/025 , C08L2205/03
摘要： A first sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more. A second sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (1): Mg1-xAlx(OH)2(CO3)x/2·mH2O, in which each of x and m independently represents a positive number, and a magnesium-containing compound that is different from the hydrotalcite compound. A third sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (I), and a magnesium oxide, and a content of the magnesium oxide is from 1 part by mass to 50 parts by mass parts with respect to 100 mass parts of the epoxy resin.
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公开(公告)号：US11773291B2
公开(公告)日：2023-10-03
申请号：US16497558
申请日：2018-01-29
IPC分类号： C09G1/02 , C08K3/20 , C08K5/09 , C08K5/17 , C08L71/02 , H01L21/304 , H01L21/3105 , C09K13/00 , H01L21/306 , C08K3/22 , C03C15/02
CPC分类号： C09G1/02 , C08K3/20 , C08K5/09 , C08K5/17 , C08L71/02 , C09K13/00 , H01L21/304 , H01L21/30625 , H01L21/31053 , C03C15/02 , C08K2003/2213
摘要： A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a liquid medium, in which a zeta potential of the abrasive grains is positive and a weight average molecular weight of the cationic compound is less than 1000.
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公开(公告)号：US11732124B2
公开(公告)日：2023-08-22
申请号：US16767442
申请日：2017-11-30
CPC分类号： C08L63/00 , C08L91/06 , H01F1/153 , C08K2003/0856 , C08L2203/20 , C08L2205/03
摘要： A compound comprises a resin composition containing an epoxy resin, a phenol resin, a wax, and an imidazole compound, and a metal element-containing powder, wherein the epoxy resin comprises a crystalline epoxy resin, the wax comprises a montanic acid ester, and the content of the metal element-containing powder is 90 mass % or more based on the total mass of the compound.
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公开(公告)号：US11702569B2
公开(公告)日：2023-07-18
申请号：US16642120
申请日：2018-08-30
IPC分类号： C09G1/02 , C09K3/14 , H01L21/3105
CPC分类号： C09G1/02 , C09K3/1436 , H01L21/31053
摘要： A slurry containing abrasive grains, a liquid medium, and a salt of a compound represented by formula (1) below, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, and the second particles contain a hydroxide of a tetravalent metal element.
[In formula (1), R represents a hydroxyl group or a monovalent organic group].-
公开(公告)号：US11674039B2
公开(公告)日：2023-06-13
申请号：US16486355
申请日：2017-02-20
发明人： Atsushi Takahashi
IPC分类号： C08G73/14 , C08L79/08 , C08G73/10 , C09D127/12 , C09D179/08
CPC分类号： C08L79/08 , C08G73/1032 , C08G73/1035 , C09D127/12 , C09D179/08
摘要： Disclosed are a polyamideimide resin composition comprising (A) a polyamideimide resin, (B) a 3-alkoxy-N,N-dimethylpropanamide, and (C) water; and a fluorine-based coating material comprising the polyamideimide resin composition and a fluororesin.
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9.发明授权公开(公告)号：US11639426B2
公开(公告)日：2023-05-02
申请号：US16474139
申请日：2016-12-28
发明人： Akihiro Ito , Michiaki Yajima , Mika Kobune , Takahiro Ikabata
IPC分类号： C08L23/08 , C08L23/16 , C08L23/22 , C08L101/00 , C08J5/18 , C08K3/04 , C08K5/00 , C08K7/24 , H01L23/373
摘要： A heat conduction sheet, includes at least one kind of graphite particle (A) selected from the group consisting of scale-like particles, ellipsoidal particles and rod-like particles; a polymer (B) having an isobutylene structure; an ethylene-propylene copolymer (C); and an ethylene octene elastomer (D), in which, in a case of scale-like particles, a plane direction of the particle is oriented in a thickness direction of the heat conduction sheet, and in a case of ellipsoidal particles or rod-like particles, a long axis direction of the particle is oriented in the thickness direction of the heat conduction sheet.
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10.发明授权公开(公告)号：US11624016B2
公开(公告)日：2023-04-11
申请号：US16096335
申请日：2017-04-11
IPC分类号： C09J175/16 , C09J175/04 , C08G18/40 , C08G18/69 , C08G18/76 , C08G18/10 , C08G18/30 , C09J11/00 , C09J11/06 , C08G18/12 , C08G18/42 , C08G18/48 , C08G18/62 , C08K5/13 , C09J5/06
摘要： A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.
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