-
公开(公告)号：US11462502B2
公开(公告)日：2022-10-04
申请号：US16493507
申请日：2018-01-18
发明人： Yuki Kawana , Hideo Nakako , Motohiro Negishi , Dai Ishikawa , Chie Sugama , Yoshinori Ejiri
摘要： Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 μM.
-
公开(公告)号：US20150217411A1
公开(公告)日：2015-08-06
申请号：US14425980
申请日：2013-08-05
IPC分类号： B23K35/30 , H01L23/00 , C22C5/06 , B23K35/02 , B23K35/362
CPC分类号： B23K35/3006 , B23K35/025 , B23K35/362 , C22C5/06 , H01B1/22 , H01L23/3107 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/2732 , H01L2224/29139 , H01L2224/2929 , H01L2224/29339 , H01L2224/32221 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/8384 , H01L2224/92247 , H01L2924/014 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/203 , H01L2924/2064 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2924/0002
摘要： A silver paste composition comprising silver particles having a particle diameter of 0.1 μm to 20 μm, and a solvent, wherein the above-described solvent comprises a solvent having a boiling point of 300° C. or more.
摘要翻译： 一种银糊剂组合物，其包含粒径为0.1μm至20μm的银颗粒和溶剂，其中上述溶剂包含沸点为300℃或更高的溶剂。
-
公开(公告)号：US11887960B2
公开(公告)日：2024-01-30
申请号：US16757798
申请日：2018-10-23
发明人： Motohiro Negishi , Hideo Nakako , Yuki Kawana , Dai Ishikawa , Chie Sugama , Yoshinori Ejiri
IPC分类号： H01L23/00 , B22F7/06 , B22F7/08 , B23K35/02 , B23K35/30 , B22F1/05 , B22F1/107 , B22F7/04 , B22F1/102 , B22F1/052
CPC分类号： H01L24/29 , B22F1/05 , B22F1/107 , B22F7/064 , B22F7/08 , B23K35/025 , B23K35/302 , H01L24/83 , B22F1/052 , B22F1/102 , B22F2007/047 , B22F2301/10 , B22F2304/10 , B22F2998/10 , H01L2224/29013 , H01L2224/29247 , H01L2224/8384 , B22F2998/00 , B22F1/068 , B22F1/065 , B22F2999/00 , B22F1/107 , C22C1/0425 , B22F2007/047
摘要： This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.
-
公开(公告)号：US11483936B2
公开(公告)日：2022-10-25
申请号：US16762041
申请日：2018-11-08
发明人： Hideo Nakako , Yoshinori Ejiri , Dai Ishikawa , Chie Sugama , Yuki Kawana , Motohiro Negishi , Yuichi Yanaka
摘要： Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1−M2)/M1×100≥1.0 (I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.]
-
公开(公告)号：US11040416B2
公开(公告)日：2021-06-22
申请号：US15757896
申请日：2016-09-07
发明人： Dai Ishikawa , Yuki Kawana , Chie Sugama , Hideo Nakako , Yoshinori Ejiri , Kazuhiko Kurafuchi
摘要： Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 μm to 0.8 μm, and flake-shaped micro copper particles having a maximum particle size of 1 μm to 20 μm, and an aspect ratio of 4 or greater, and the amount of the micro copper particles contained, which are included in the metal particles and have a maximum particle size of 1 μm to 20 μm and an aspect ratio of less than 2, is 50% by mass or less on the basis of a total amount of the flake-shaped micro copper particles.
-
公开(公告)号：US10201879B2
公开(公告)日：2019-02-12
申请号：US14425980
申请日：2013-08-05
摘要： A silver paste composition comprising silver particles having a particle diameter of 0.1 μm to 20 μm, and a solvent, wherein the above-described solvent comprises a solvent having a boiling point of 300° C. or more.
-
公开(公告)号：US10174226B2
公开(公告)日：2019-01-08
申请号：US14407579
申请日：2013-06-14
摘要： An adhesive composition comprising silver particles containing silver atoms and zinc particles containing metallic zinc, wherein the silver atom content is 90 mass % or greater and the zinc atom content is from 0.01 mass % to 0.6 mass %, with respect to the total transition metal atoms in the solid portion of the adhesive composition.
-
公开(公告)号：US10930612B2
公开(公告)日：2021-02-23
申请号：US16476969
申请日：2017-01-11
发明人： Hideo Nakako , Kazuhiko Kurafuchi , Yoshinori Ejiri , Dai Ishikawa , Chie Sugama , Yuki Kawana
摘要： A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.
-
公开(公告)号：US10566304B2
公开(公告)日：2020-02-18
申请号：US15757852
申请日：2016-09-07
发明人： Hideo Nakako , Kazuhiko Kurafuchi , Yoshinori Ejiri , Dai Ishikawa , Chie Sugama , Yuki Kawana
IPC分类号： H01L23/34 , H01L23/00 , B22F7/08 , B22F1/00 , H01L23/367
摘要： Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.
-
10.发明授权公开(公告)号：US10363608B2
公开(公告)日：2019-07-30
申请号：US15757790
申请日：2016-09-07
发明人： Yuki Kawana , Kazuhiko Kurafuchi , Yoshinori Ejiri , Hideo Nakako , Chie Sugama , Dai Ishikawa
摘要： Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 μm to 0.8 μm, and micro copper particles having a volume-average particle size of 2 μm to 50 μm, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.023 秒)
