Invention Grant
- Patent Title: Multilayer substrate
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Application No.: US16294975Application Date: 2019-03-07
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Publication No.: US11043626B2Publication Date: 2021-06-22
- Inventor: Kuniaki Yosui , Shingo Ito , Isamu Morita , Naoki Gouchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2016-207871 20161024
- Main IPC: H01L41/047
- IPC: H01L41/047 ; H01L41/083 ; H01L41/09 ; H01L41/193 ; H01F27/28 ; H01F27/32 ; H05K1/18 ; H01F7/20 ; H05K3/46 ; H05K1/14 ; H05K1/16 ; H01F17/00

Abstract:
A multilayer substrate includes a stacked body including first and second flexible insulating base material layers, and an actuator conductor pattern on at least the first insulating base material layer. The stacked body includes a first region including stacked first and second insulating base material layers, and a second region including stacked second insulating base material layers. The first region includes an actuator function portion in a portion thereof, the actuator function portion including the actuator conductor pattern. The thickness of the first insulating base material layer including the actuator conductor pattern is smaller than the thickness of one second insulating base material layer.
Public/Granted literature
- US20190207077A1 MULTILAYER SUBSTRATE Public/Granted day:2019-07-04
Information query
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