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公开(公告)号：US11581117B2
公开(公告)日：2023-02-14
申请号：US15695037
申请日：2017-09-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui , Shingo Ito
IPC: H01F17/00 , H01F41/04 , H01F41/071 , H01F27/28 , H01F27/29
Abstract: A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.
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公开(公告)号：US11469027B2
公开(公告)日：2022-10-11
申请号：US15632415
申请日：2017-06-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shuichi Kezuka , Kuniaki Yosui
IPC: H01F17/00 , H05K1/16 , H01L23/14 , H01L23/498 , H05K3/46
Abstract: In a built-in coil substrate, coil conductor patterns are provided on insulating base materials. Coil interlayer connection conductors, which provide interlayer connection between the coil conductor patterns, are provided on the insulating base materials and made of conductive paste. First and second external electrodes are provided on a first principal surface of a multilayer body. One of the coil conductor patterns is connected to the first external electrode by first-external-electrode connection conductors made of the conductive paste. Another one of the coil conductor patterns is connected to the second external electrode by a second-external-electrode connection conductor. The second-external-electrode connection conductor is a metal film provided in a through hole that extends through the multilayer body in a stacking direction in which the insulating base materials are stacked.
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公开(公告)号：US11291109B2
公开(公告)日：2022-03-29
申请号：US17066514
申请日：2020-10-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui
Abstract: A transmission line includes connecting portions connected to the outside and a main body located between the connecting portions. Each of the connecting portions includes a terminal electrode connected to an external electrode, a signal conductor, and ground conductors. The main body includes the signal conductor and the ground conductors, and at least one of the plurality of connecting portions includes a first region including the terminal electrode, a second region adjacent to the first region along a signal propagation path, and a third region located between the second region and the main body. The first region, the second region, and the third region provide impedance matching at the connecting portion.
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公开(公告)号：US11245171B2
公开(公告)日：2022-02-08
申请号：US16877525
申请日：2020-05-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui
Abstract: A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.
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公开(公告)号：US11114238B2
公开(公告)日：2021-09-07
申请号：US16145245
申请日：2018-09-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui
Abstract: A multilayer substrate includes a lamination body including first and second resin substrates and a bonding layer that are hot-pressed. The first resin substrate includes a first surface provided with a first conductor pattern including a surface defined by a plated film, and a second surface provided with a second conductor pattern including a surface defined by a plated film. The second resin substrate includes a third surface provided with a third conductor pattern including a surface defined by a plated film, and a fourth surface provided with a fourth conductor pattern including a surface defined by a plated film. The first conductor pattern is located closer to a first outermost layer than the second conductor pattern. T1
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Patent Agency Ranking
公开(公告)号：US10709014B2
公开(公告)日：2020-07-07
申请号：US16297765
申请日：2019-03-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui
Abstract: A multilayer substrate includes a differential line including first and second line conductors provided on or in a laminated body including base material layers. The differential line includes line portions and a connecting portion that connects the line portions. The connecting portion includes first parallel conductors extending in parallel or substantially in parallel with each other, first interlayer connecting conductors that connect the first parallel conductors in parallel, and connect the first line conductor to the first parallel conductors, second parallel conductors extending in parallel or substantially in parallel with each other, and second interlayer connecting conductors that connect the second parallel conductors in parallel, and connect the second line conductor to the second parallel conductors. The first parallel conductors cross the second parallel conductors as viewed in a laminating direction of the base material layers.
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公开(公告)号：US10188000B2
公开(公告)日：2019-01-22
申请号：US16055207
申请日：2018-08-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui
Abstract: An insulating board includes a first portion that is relatively thick and a second portion that is relatively thin. The first and second portions have different thicknesses so that a step is provided therebetween. The insulating board includes a first land conductor on a first mounting surface of the first portion at a side at which the step is provided, a second land conductor on a second mounting surface of the second portion at the side at which the step is provided, and an insulating protection film on the first mounting surface so that a portion of the first land conductor is exposed and another portion of the first land conductor is covered. An electronic component is soldered to the first land conductor. Another electronic component is joined to the second land conductor by an anisotropic conductive film that covers the second land conductor.
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公开(公告)号：US10147529B2
公开(公告)日：2018-12-04
申请号：US14864948
申请日：2015-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kosuke Nishino , Kuniaki Yosui
IPC: G02B7/02 , H01L27/08 , H01F27/30 , H01F27/28 , H01F7/20 , G03B5/00 , H02K41/035 , G02B27/64 , H01F5/00 , H02K3/26
Abstract: An electromagnet that increases electromagnetic force involved with a current flowing through a coil includes a stacked body including a plurality of base material layers, a coil including an in-plane coil conductor on one main surface of each of the base material layers, and an electrically isolated dummy pattern extending along at least a portion of the coil outside of the in-plane coil conductor on each of the base material layers in a plan view.
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公开(公告)号：US10135140B2
公开(公告)日：2018-11-20
申请号：US13765541
申请日：2013-02-12
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Kuniaki Yosui , Hiroyuki Kubo , Hiromitsu Ito
Abstract: An antenna includes antenna coil having a magnetic-material core and a coil conductor. The antenna coil is arranged toward a side of a planar conductor, such as a circuit board. Of the coil conductor, a first conductor part close to a first main face of the magnetic-material core and a second conductor part close to a second main face of the magnetic-material core are provided such that the first conductor part is not over the second conductor part in view from a line in a direction normal to the first main face or the second main face of the magnetic-material core. In addition, a coil axis of the coil conductor is orthogonal to the side of the planar conductor.
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公开(公告)号：US10123414B2
公开(公告)日：2018-11-06
申请号：US15442769
申请日：2017-02-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui , Bunta Okamoto , Isamu Morita , Jun Sasaki
Abstract: A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.
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