- 专利标题: Linear groove formation method and linear groove formation device
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申请号: US15575920申请日: 2016-07-06
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公开(公告)号: US11045902B2公开(公告)日: 2021-06-29
- 发明人: Shigehiro Takajo , Masanori Uesaka
- 申请人: JFE STEEL CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: JFE STEEL CORPORATION
- 当前专利权人: JFE STEEL CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Kenja IP Law PC
- 优先权: JPJP2015-148891 20150728
- 国际申请: PCT/JP2016/003217 WO 20160706
- 国际公布: WO2017/017908 WO 20170202
- 主分类号: B23K26/073
- IPC分类号: B23K26/073 ; C25F3/06 ; C23F1/28 ; B23K26/364 ; C21D8/12 ; C21D10/00 ; H01F1/16
摘要:
A linear groove formation method of forming linear grooves in a steel sheet surface using etching can form linear grooves of a uniform shape while suppressing a decrease in magnetic property of a grain-oriented electrical steel sheet caused by laser irradiation for resist removal. A linear groove formation method includes: coating a surface of a grain-oriented electrical steel sheet with a resist; performing a laser scan cyclically in a rolling direction of the grain-oriented electrical steel sheet, the laser scan being applying a laser while scanning the laser in a direction crossing the rolling direction to remove the resist in a portion irradiated with the laser; and etching the grain-oriented electrical steel sheet in each portion in which the resist is removed, to form a linear groove. A coating thickness of the resist is 0.5 μm to 10 μm, and a power of the laser is 1500 W or more.
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