- 专利标题： Redistribution metal and under bump metal interconnect structures and method
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申请号： US16700528申请日： 2019-12-02
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公开(公告)号： US11049829B2公开(公告)日： 2021-06-29
- 发明人: Sam Ziqun Zhao , Liming Tsau , Edward Law , Andy Brotman
- 申请人： Avago Technologies International Sales Pte. Limited
- 申请人地址： SG Singapore
- 专利权人： Avago Technologies International Sales Pte. Limited
- 当前专利权人： Avago Technologies International Sales Pte. Limited
- 当前专利权人地址： SG Singapore
- 代理机构： Foley & Lardner LLP
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/50 ; H01L23/31
摘要：
An integrated circuit die includes a metal layer, a first passivation layer disposed above the metal layer, an aluminum containing redistribution layer disposed above the first passivation layer, an under bump metallization layer, and a redistribution layer plug. The redistribution layer plug is coupled to the metal layer and disposed in a via in the first passivation layer. The under bump metallization layer is coupled to the aluminum containing redistribution layer above the first passivation layer at a distance from the redistribution layer plug.
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