公开(公告)号：US20230296664A1

公开(公告)日：2023-09-21

申请号：US17700186

申请日：2022-03-21

申请人： Avago Technologies International Sales Pte. Limited

发明人： Xiaoming Li ,  Liming Tsau ,  Andy Brotman

IPC分类号： G01R31/28 ,  H01L23/58

CPC分类号： G01R31/2858 ,  H01L23/585 ,  G01R31/2896

摘要： A semiconductor product, which comprises a semiconductor chip, an edge integrity detection structure extending along at least part of an edge of the semiconductor chip, and evaluation circuitry formed in and/or on the semiconductor chip, being electrically connected with the edge integrity detection structure, and being configured to evaluate an electric characteristic of the edge integrity detection structure to provide an evaluation signal indicative of a detected edge integrity status of the edge.

公开(公告)号：US11049829B2

公开(公告)日：2021-06-29

申请号：US16700528

申请日：2019-12-02

申请人： Avago Technologies International Sales Pte. Limited

发明人： Sam Ziqun Zhao ,  Liming Tsau ,  Edward Law ,  Andy Brotman

IPC分类号： H01L23/00 ,  H01L23/50 ,  H01L23/31

摘要： An integrated circuit die includes a metal layer, a first passivation layer disposed above the metal layer, an aluminum containing redistribution layer disposed above the first passivation layer, an under bump metallization layer, and a redistribution layer plug. The redistribution layer plug is coupled to the metal layer and disposed in a via in the first passivation layer. The under bump metallization layer is coupled to the aluminum containing redistribution layer above the first passivation layer at a distance from the redistribution layer plug.