- 专利标题： Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
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申请号： US16248312申请日： 2019-01-15
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公开(公告)号： US11049839B2公开(公告)日： 2021-06-29
- 发明人: Ai Jun Song , Jeremy Neyhart , Thomas Colosimo , Benjamin D. Trabin , Matthew B. Wasserman
- 申请人： Kulicke and Soffa Industries, Inc.
- 申请人地址： US PA Fort Washington
- 专利权人： Kulicke and Soffa Industries, Inc.
- 当前专利权人： Kulicke and Soffa Industries, Inc.
- 当前专利权人地址： US PA Fort Washington
- 代理商 Christopher M. Spletzer, Sr.
- 主分类号： B32B7/00
- IPC分类号： B32B7/00 ; H01L23/00 ; B23K1/00 ; B23K3/08 ; B23K1/008 ; B23K101/40 ; B23K101/42
摘要：
A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.
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