公开(公告)号：US20210272926A1

公开(公告)日：2021-09-02

申请号：US17324977

申请日：2021-05-19

申请人： Kulicke and Soffa Industries, Inc.

发明人： Ai Jun Song ,  Jeremy Neyhart ,  Thomas Colosimo ,  Benjamin D. Trabin ,  Matthew B. Wasserman

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K3/08 ,  B23K1/008

摘要： A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.

公开(公告)号：US11342301B2

公开(公告)日：2022-05-24

申请号：US17324977

申请日：2021-05-19

申请人： Kulicke and Soffa Industries, Inc.

发明人： Ai Jun Song ,  Jeremy Neyhart ,  Thomas Colosimo ,  Benjamin D. Trabin ,  Matthew B. Wasserman

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K3/08 ,  B23K1/008 ,  B23K101/40 ,  B23K101/42

摘要： A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.

公开(公告)号：US11049839B2

公开(公告)日：2021-06-29

申请号：US16248312

申请日：2019-01-15

申请人： Kulicke and Soffa Industries, Inc.

发明人： Ai Jun Song ,  Jeremy Neyhart ,  Thomas Colosimo ,  Benjamin D. Trabin ,  Matthew B. Wasserman

IPC分类号： B32B7/00 ,  H01L23/00 ,  B23K1/00 ,  B23K3/08 ,  B23K1/008 ,  B23K101/40 ,  B23K101/42

摘要： A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.

公开(公告)号：US20190229084A1

公开(公告)日：2019-07-25

申请号：US16248312

申请日：2019-01-15

申请人： Kulicke and Soffa Industries, Inc.

发明人： Ai Jun Song ,  Jeremy Neyhart ,  Thomas Colosimo ,  Benjamin D. Trabin ,  Matthew B. Wasserman

IPC分类号： H01L23/00 ,  B23K1/00

摘要： A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.