- 专利标题: Semiconductor module and power conversion device
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申请号: US16632029申请日: 2018-08-27
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公开(公告)号: US11063025B2公开(公告)日: 2021-07-13
- 发明人: Junichi Nakashima , Shota Morisaki , Yoshiko Tamada , Yasushi Nakayama , Tetsu Negishi , Ryo Tsuda , Yukimasa Hayashida , Ryutaro Date
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Chiyoda-ku
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Chiyoda-ku
- 代理机构: Xsensus LLP
- 优先权: JPJP2017-169446 20170904
- 国际申请: PCT/JP2018/031521 WO 20180827
- 国际公布: WO2019/044748 WO 20190307
- 主分类号: H01L25/07
- IPC分类号: H01L25/07 ; H01L23/00 ; H02P27/06
摘要:
Gates of a plurality of semiconductor switching elements are electrically connected to a common gate control pattern by gate wires. Sources of the plurality of semiconductor switching elements are electrically connected to a common source control pattern by source wires. The gate control pattern is disposed to interpose the source control pattern between the gate control pattern and each of the plurality of semiconductor switching elements that are connected in parallel and that operate in parallel. Hence, each of the gate wires becomes longer than each of the source wires, and has an inductance larger than the source wire. Accordingly, gate oscillation is reduced or suppressed in the plurality of semiconductor switching elements that are connected in parallel and that operate in parallel.
公开/授权文献
- US20200185359A1 SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE 公开/授权日:2020-06-11
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