- Patent Title: Imaging element having transfer gate structure comprising a trench
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Application No.: US16482397Application Date: 2018-02-19
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Publication No.: US11069727B2Publication Date: 2021-07-20
- Inventor: Takashi Machida , Ryoto Yoshita
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JPJP2017-040136 20170303
- International Application: PCT/JP2018/005652 WO 20180219
- International Announcement: WO2018/159345 WO 20180907
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/3745 ; H04N9/04

Abstract:
The imaging element includes, within a pixel, a semiconductor substrate, a photoelectric conversion unit formed in the semiconductor substrate, a first charge storage unit that stores a charge generated by the photoelectric conversion unit, and a first transfer gate unit formed on an opposite surface of the semiconductor substrate on an opposite side of a light incident surface and used for transfer of a charge from the photoelectric conversion unit to the first charge storage unit. The first transfer gate unit includes a first electrode embedded in a first trench formed in the semiconductor substrate from the opposite surface of the semiconductor substrate. The photoelectric conversion unit includes the first electrode, and a second electrode surrounding at least a portion of a periphery of the first electrode.
Public/Granted literature
- US20200035724A1 IMAGING ELEMENT Public/Granted day:2020-01-30
Information query
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