- 专利标题： Apparatus, system, and method of providing a ramped interconnect for semiconductor fabrication
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申请号： US17003595申请日： 2020-08-26
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公开(公告)号： US11081375B2公开(公告)日： 2021-08-03
- 发明人: Lim Lai Ming , Zambri Bin Samsudin
- 申请人： JABIL INC.
- 申请人地址： US FL St. Petersburg
- 专利权人： JABIL INC.
- 当前专利权人： JABIL INC.
- 当前专利权人地址： US FL St. Petersburg
- 代理机构： Barnes & Thornburg LLP
- 代理商 Thomas J. McWilliams
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; C23C18/08 ; H01L21/48
摘要：
The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.
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