公开(公告)号：US20230363094A1

公开(公告)日：2023-11-09

申请号：US18245024

申请日：2021-09-13

申请人： Jabil Inc.

发明人： Zambri Bin Samsudin ,  Idris Bin Mansor

IPC分类号： H05K13/08 ,  H05K3/12 ,  H05K3/34

CPC分类号： H05K3/341 ,  H05K3/1225 ,  H05K3/3494 ,  H05K13/085

摘要： Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint reliability.

公开(公告)号：US20210360781A1

公开(公告)日：2021-11-18

申请号：US17053234

申请日：2018-05-08

申请人： Jabil Inc.

发明人： Fakhrozi Che Ani ,  Zambri Bin Samsudin ,  Mohd Yusuf Tura Ali ,  Zulkifli Ahmad

IPC分类号： H05K1/02 ,  C09D11/52 ,  C09D11/102 ,  H05K1/03 ,  C08K3/08 ,  C08G77/08 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/12 ,  C08K5/549

摘要： A system and method for forming a stretchable conductive circuit package that utilizes an addition and condensation mechanism incorporated into one system. When the stretchable conductive ink is used in a circuit package, the circuit package has high reliability and durability.

公开(公告)号：US11862492B2

公开(公告)日：2024-01-02

申请号：US17391120

申请日：2021-08-02

申请人： JABIL INC.

发明人： Lim Lai Ming ,  Zambri Bin Samsudin

IPC分类号： H01L21/67 ,  C23C18/08 ,  H01L21/48

CPC分类号： H01L21/67138 ,  C23C18/08 ,  H01L21/485

摘要： The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.

公开(公告)号：US20220093424A1

公开(公告)日：2022-03-24

申请号：US17391120

申请日：2021-08-02

申请人： JABIL INC.

发明人： Lim Lai Ming ,  Zambri Bin Samsudin

IPC分类号： H01L21/67 ,  C23C18/08 ,  H01L21/48

摘要： The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.

公开(公告)号：US20240178016A1

公开(公告)日：2024-05-30

申请号：US18529193

申请日：2023-12-05

申请人： JABIL INC.

发明人： Lim Lai Ming ,  Zambri Bin Samsudin

IPC分类号： H01L21/67 ,  C23C18/08 ,  H01L21/48

CPC分类号： H01L21/67138 ,  C23C18/08 ,  H01L21/485

摘要： The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.

公开(公告)号：US11081375B2

公开(公告)日：2021-08-03

申请号：US17003595

申请日：2020-08-26

申请人： JABIL INC.

发明人： Lim Lai Ming ,  Zambri Bin Samsudin

IPC分类号： H01L21/67 ,  C23C18/08 ,  H01L21/48

摘要： The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.

公开(公告)号：US20200267844A1

公开(公告)日：2020-08-20

申请号：US16278472

申请日：2019-02-18

申请人： Jabil Inc.

发明人： LaiMing Lim ,  Zambri Bin Samsudin

IPC分类号： H05K3/30 ,  H05K3/32 ,  H05K1/02

摘要： Disclosed are processes and materials for adhesive circuit patterning which strengthen and protect printed circuit traces and adhesive bonded joints of surface mounted devices in flexible or stretchable electronics in a single process. A method for adhesive circuit pattering include deposing a circuit pattern on a thermal adhesive film. One or more surface mounted device(s) are attached to a cured printed circuit to form an assembled printed circuit. The assembled printed circuit may be placed on a stretchable substrate. The thermal adhesive film is melted on the assembled printed circuit and the stretchable substrate to protect and reinforce joint bonds and the circuit pattern of the assembled circuit pattern and attach the assembled printed circuit to the stretchable fabric in one melting or curing step.